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Northrop Grumman Introduces Multifunction AESA Sensor

Valen is a compact wideband active electronically scanned array integrating radar, electronic warfare and communications for crewed and uncrewed platforms.

  www.northropgrumman.com
Northrop Grumman Introduces Multifunction AESA Sensor
Valen was successfully flight tested on Northrop Grumman owned CRJ-700s. (Photo Credit: Northrop Grumman) 
 
Northrop Grumman has introduced Valen, a multifunction active electronically scanned array (AESA) designed to combine radar, electronic warfare (EW) and communications capabilities within a single, compact architecture. The system is intended for integration across crewed and uncrewed air platforms and space-based applications.

Wideband Multifunction Architecture
Valen is based on wideband AESA technology, enabling operation across multiple frequency bands within a unified array. AESA systems use electronically steered antenna elements to transmit and receive signals without mechanical movement, allowing rapid beam steering, simultaneous multi-mission operation and high reliability due to reduced moving parts.

By combining radar sensing, EW functions and communications in one array, the system reduces the need for multiple discrete apertures. This consolidation can lower platform weight, simplify integration and reduce aerodynamic drag on airborne systems.

The compact and lightweight design supports installation on size- and power-constrained platforms, including unmanned aerial systems and satellites.

Digital Design and Additive Manufacturing
Valen is digitally designed and produced using additive manufacturing techniques. The use of 3D printing is intended to shorten development and production cycles by reducing tooling requirements and enabling rapid iteration of complex structures.

According to the company, the program has been fully self-funded, allowing internal development and acceleration toward production readiness.

Advanced Microelectronics and Thermal Management
Performance enhancements are supported by advanced semiconductor packaging developed at Northrop Grumman’s Microelectronics Center. Multiple semiconductor components are integrated into micro-scale packages, reducing interconnect distances and improving signal integrity.

This packaging approach supports higher processing speeds, improved thermal management and lower power consumption within a reduced footprint. Efficient heat dissipation is particularly critical for AESA systems, where densely packed transmit/receive modules generate significant thermal loads.


Northrop Grumman Introduces Multifunction AESA Sensor
With its lightweight design, Valen can integrate into newly designed systems or modernize existing platforms. (Photo Credit: Northrop Grumman) 

Open Architecture and Upgradeability
Valen is built in accordance with open-architecture standards, enabling hardware and software modularity. Open systems facilitate integration with third-party subsystems and support rapid capability updates without full hardware replacement.

Such architectures are increasingly required in defense applications to accommodate evolving threat environments and enable faster deployment of software-defined capabilities.

Tactical Sensing and Situational Awareness
As an AESA platform, Valen provides rapid detection, tracking and imaging in multiple directions without mechanical scanning. Electronic beam steering allows simultaneous engagement of multiple functions, such as target tracking while conducting electronic surveillance.

By integrating sensing, electronic attack or protection, and communications into a single array, the system aims to enhance situational awareness and reduce system complexity across air and space domains.

The introduction of Valen expands Northrop Grumman’s advanced sensing portfolio with a compact, multifunction AESA designed for rapid production and adaptable deployment in modern defense platforms.

www.northropgrumman.com

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